Title:
LASER PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND EXAMINATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/071458
Kind Code:
A1
Abstract:
An examination device is provided with: a stage which supports a wafer in which a plurality of columns of modification region are formed in a semiconductor substrate; a light source which outputs light transmitted through the semiconductor substrate; an objective lens which allows passage of light that has propagated through the semiconductor substrate; a light detection unit which detects light that has passed through the objective lens; and an examination unit which determines whether, in an examination region between a first modification region closest to an upper surface of the semiconductor substrate and a second modification region closest to the first modification region, a tip-end of a crack extending from the first modification region toward the back-surface side of the semiconductor substrate exists. The objective lens places a focal point in the examination region from the back-surface side. The light detection unit detects light propagating in the semiconductor substrate from the upper-surface side to the back-surface side thereof.
Inventors:
SAKAMOTO TAKESHI (JP)
SUZUKI YASUTAKA (JP)
SANO IKU (JP)
SUZUKI YASUTAKA (JP)
SANO IKU (JP)
Application Number:
PCT/JP2019/039013
Publication Date:
April 09, 2020
Filing Date:
October 02, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/301; B23K26/00; B23K26/53; B24B7/00; B24B49/12
Foreign References:
| JP2017064746A | 2017-04-06 | |||
| JP2017133997A | 2017-08-03 | |||
| JP2018098296A | 2018-06-21 | |||
| JP2007132761A | 2007-05-31 | |||
| JP2006147818A | 2006-06-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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