LASER PROCESSING MONITORING METHOD, AND LASER PROCESSING MONITORING DEVICE

Title:

LASER PROCESSING MONITORING METHOD, AND LASER PROCESSING MONITORING DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/059825

Kind Code:

A1

Abstract:

This laser processing monitoring device is a monitoring device of a laser processing machine which performs desired laser processing by radiating a laser beam LB onto a given metal workpiece W and melting the workpiece W by means of laser energy, wherein the laser processing monitoring device comprises: a laser oscillator 10; a laser power source 12; a control unit 14; a guide light generating unit 15; transmission optical fibers 16, 17; a head 18 (emitting unit 24, sensor unit 26); an operating panel 20; and a monitoring unit 25. The monitoring unit 25 is a laser monitoring device in a mode of embodiment of the present invention, and is configured to include mainly the control unit 14, the operating panel 20, a sensor signal processing unit 22 and the sensor unit 26, for example.

Inventors:

YANASE ATSUSHI (JP)
NISHIZAKI YUSUKE (JP)
WATANABE HARUHIKO (JP)
SHINO JUNICHI (JP)

Application Number:

PCT/JP2020/031991

Publication Date:

April 01, 2021

Filing Date:

August 25, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

AMADA WELD TECH CO LTD (JP)
AMADA CO LTD (JP)

International Classes:

B23K26/00

Domestic Patent References:

WO2018185973A1

2018-10-11

Foreign References:

JP2018039028A	2018-03-15
JP2008188622A	2008-08-21
JP2010110796A	2010-05-20
JP2019173983A	2019-10-10

Other References: