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Title:
LASER PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/138684
Kind Code:
A1
Abstract:
A laser processing system is disclosed. The disclosed laser processing system comprises: a detection unit for detecting a thickness of a workpiece in an optical manner; a laser irradiation unit for irradiating a laser beam onto the workpiece on the basis of the thickness detected by the detection unit; and a cooling unit configured to cool the detection unit.

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Inventors:
LEE YONG WOO (KR)
HUR JEEN (KR)
CHOI YOUNG JUN (KR)
SHIN DONG SOO (KR)
LEE JUN YOUNG (KR)
KIM YOO SUK (KR)
CHO KYU HWAN (KR)
JUNG HYUN TAEK (KR)
Application Number:
PCT/KR2016/010051
Publication Date:
August 17, 2017
Filing Date:
September 08, 2016
Export Citation:
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Assignee:
EO TECHNICS CO LTD (KR)
International Classes:
B23K26/00; B23K26/03; B23K26/08; B23K26/36; B23K26/70; B23Q17/24
Foreign References:
KR101425493B12014-08-04
JP2001141437A2001-05-25
KR20130143433A2013-12-31
KR100920565B12009-10-08
KR20130121718A2013-11-06
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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