LASER PROCESSOR AND PROCESSING CONDITION SETTING METHOD

Title:

LASER PROCESSOR AND PROCESSING CONDITION SETTING METHOD

Document Type and Number:

WIPO Patent Application WO/2020/218269

Kind Code:

A1

Abstract:

According to the present invention, a theoretical value calculation unit (91) calculates a theoretical value of a cutting speed on the basis of a cutting speed theoretical equation for calculating the theoretical value of the cutting speed according to the material of a metal plate W and the plate thickness (tc). A parameter adjustment unit (92) adjusts a parameter forming the cutting speed theoretical equation and corrects the cutting speed theoretical equation. A processing condition setting unit (93) sets the cutting speed of a processing condition on the basis of the cutting speed theoretical equation corrected by the parameter adjustment unit 92. The cutting speed theoretical equation includes an average absorptivity (Aave) as an adjustable parameter by the parameter adjustment unit (92).

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Inventors:

SAKO HIROSHI (JP)
ISHIGURO HIROAKI (JP)

Application Number:

PCT/JP2020/017130

Publication Date:

October 29, 2020

Filing Date:

April 21, 2020

Export Citation:

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Assignee:

AMADA CO LTD (JP)

International Classes:

B23K26/38; B23K26/00

Foreign References:

JP2014166640A	2014-09-11
JP2016078065A	2016-05-16
JPH0259188A	1990-02-28