LASER ROBOT PATH PLANNING METHOD, AND CHIP

WIPO Patent Application WO/2024/078256

A1

Disclosed in the present application are a laser robot path planning method, and a chip. The method comprises: acquiring a target starting point of a laser robot and a target end point of the laser robot; on the basis of a first map, determining whether the target starting point of the laser robot and the target end point of the laser robot are distributed in the same area; if yes, planning a movement path of the laser robot according to the target starting point and the target end point of the laser robot on the basis of the first map; and if no, executing laser robot passable area expansion on the first map on the basis of a plurality of passage line segments in a second map, and, on the basis of the first map which has been subjected to the laser robot passable area expansion, the target starting point of the laser robot, and the target end point of the laser robot, planning a movement path of the laser robot. On the basis of historical coverage information of the laser robot and the manner of eliminating part of boundaries affected by dynamic obstacles, the present application prevents the laser robot from being affected by position changing of the dynamic obstacles in an environment, thereby reasonably planning movement paths.

HUANG HUIBAO (CN)
ZHOU HEWEN (CN)
CHEN ZHUOBIAO (CN)
SUN MING (CN)
XU SONGZHOU (CN)

PCT/CN2023/119017

April 18, 2024

September 15, 2023

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AMICRO SEMICONDUCTOR CO LTD (CN)

G05D1/02

CN111780775A	2020-10-16
CN111631642A	2020-09-08
CN111681246A	2020-09-18
CN111813101A	2020-10-23
KR20110026776A	2011-03-16

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