LATENT CURING AGENT AND COMPOSITION

WIPO Patent Application WO/2005/035617

A1

A latent curing agent for an epoxy resin containing a curing agent (A) for an epoxy resin and a resin coating said curing agent (A) for an epoxy resin, wherein the resin coating said curing agent (A) for an epoxy resin comprises a structure in which two of the structure (structure (1)) are bonded via a urea bonding, the structure (1) being obtained by bonding three sulfur atoms at a branching point via a linear or cyclic aliphatic hydrocarbon group optionally containing an ester structure, wherein at least one of nitrogen atoms of each structure (1) is incorporated into said urea bonding; and a one component epoxy resin composition using the latent curing agent. The above one component epoxy resin composition which can exhibit high curability and storage stability in combination. The above latent curing agent can suitably used for producing the one component epoxy resin composition, which can provide an anisotropic electroconductive material, an electroconductive adhesive material, an insulating adhesive material, a sealing material or the like which exhibits high storage stability, and also exhibits high adhesion reliability and adhesive strength and high sealability.

USUI TAKETOSHI (JP)
TAKADA YOSHIHIKO (JP)

PCT/JP2004/014866

April 21, 2005

October 07, 2004

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ASAHI KASEI CHEMICALS CORP (JP)
USUI TAKETOSHI (JP)
TAKADA YOSHIHIKO (JP)

C08G59/18; C08G59/40; H01B1/22; H05K3/32; (IPC1-7): C08G59/40

JPH04320416A	1992-11-11
JPH03234782A	1991-10-18
JPS6470523A	1989-03-16
JPH11193344A	1999-07-21
JP2000230032A	2000-08-22
JPH0453818A	1992-02-21
JPH01113480A	1989-05-02

Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)

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