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Patent Searching and Data


Title:
LAYERED BODY, MOLDED BODY, AND METHOD FOR PRODUCING MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/190957
Kind Code:
A1
Abstract:
The present invention provides a layered body, which comprises: a resin layer that contains a polypropylene having an isotactic pendant percentage of 85 to 99 mol% and a crystallization speed at 130°C of 2.5 min-1 or less; a highly adhesive layer; and a surface protective layer. The multilayered body has a recovery rate of 75% and a Martens hardness of 5 to 12 MPa, as measured from the surface protective layer side using a microhardness tester under certain conditions.

Inventors:
MATSUURA TATSURO (JP)
ARAKI RYOSUKE (JP)
TAKEMURA HIDEAKI (JP)
KONDO KANAME (JP)
Application Number:
PCT/JP2022/008560
Publication Date:
September 15, 2022
Filing Date:
March 01, 2022
Export Citation:
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Assignee:
IDEMITSU UNITECH CO LTD (JP)
International Classes:
B32B27/32; B29C51/10; B29C51/14; B32B15/085
Domestic Patent References:
WO2018151089A12018-08-23
Foreign References:
JP2020157564A2020-10-01
JP2018065333A2018-04-26
JP2020100821A2020-07-02
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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