Title:
LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/159481
Kind Code:
A1
Abstract:
Provided is a layered electronic component in which a shielding film is less likely to be separated from a surface of a laminated body. The present invention is provided with: a laminated body 1 which includes a plurality of stacked insulator layers and which has a bottom surface B, a top surface T, and a plurality of side surfaces S; and a shielding film 4 formed on the side surfaces S of the laminated body 1, wherein at least one step 3 is formed on a ridge line where the bottom surface B and the side surfaces S of the laminated body 1 are in contact with each other, and an edge 4a of the shielding film 4 is disposed inside the step 3. In other words, a portion of the edge 4a of the shielding film 4 which easily becomes a starting point of separation is located inside the step 3 so as to be protected.
Inventors:
MIYAHARA KUNIHIRO (JP)
Application Number:
PCT/JP2018/006664
Publication Date:
September 07, 2018
Filing Date:
February 23, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/36; H01F27/00; H01F41/04; H01G4/224; H01G4/30; H03H7/01; H05K9/00
Foreign References:
| US20150364255A1 | 2015-12-17 | |||
| JP2002305115A | 2002-10-18 | |||
| JPH11219837A | 1999-08-10 | |||
| JPH01295407A | 1989-11-29 | |||
| JPH113836A | 1999-01-06 | |||
| JPH0696992A | 1994-04-08 |
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
Download PDF:
Previous Patent: ELECTRIC OIL PUMP
Next Patent: LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT
Next Patent: LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT