Title:
LAYERED FILM AND LID
Document Type and Number:
WIPO Patent Application WO/2021/002206
Kind Code:
A1
Abstract:
A layered film having a heat-seal layer (A) and a resin layer (B) that is directly layered on the heat-seal layer (A), the layered film being such that: the heat-seal layer (A) contains a polylactic-acid-based resin (a1) and a polybutylene-succinate-based resin (a2); and the resin layer (B) contains, as a main resin component, at least one of a polylactic-acid-based resin (b1) and a polybutylene-succinate-based resin (b2). Using this layered film makes it possible to achieve suitable heat-sealing properties and ease of unsealing for a variety of materials, such as environmental-load-reducing materials.
Inventors:
MATSUBARA HIROAKI (JP)
KAWAGISHI HIDEKI (JP)
KAWAGISHI HIDEKI (JP)
Application Number:
PCT/JP2020/023888
Publication Date:
January 07, 2021
Filing Date:
June 18, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/36; B65D65/40
Foreign References:
| JP2007320060A | 2007-12-13 | |||
| JP2007223201A | 2007-09-06 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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