Title:
LEAD COMPONENT SUPPLY DEVICE AND SUPPLY METHOD
Document Type and Number:
WIPO Patent Application WO/2022/085116
Kind Code:
A1
Abstract:
Provided is a lead component supply device comprising a correcting device which comes in contact with and separates from a carrier tape of taped lead components to which lead components are taped, thereby correcting the carrier tape. Provided is a supply method for a radial lead component, the method including: a delivery step for delivering, to a supply position, taped radial lead components obtained by taping the radial lead components to a carrier tape; a correcting step in which a correcting device corrects the carrier tape of the taped radial lead components delivered in the delivery step; a cutting step for cutting leads of the taped radial lead components corrected in the correcting step, and separating the radial lead components from the carrier tape; and a supply step for supplying, at the supply position, the radial lead components separated from the carrier tape in the cutting step.
Inventors:
IKEDA MITSUTOSHI (JP)
OTSUBO SATORU (JP)
OTSUBO SATORU (JP)
Application Number:
PCT/JP2020/039558
Publication Date:
April 28, 2022
Filing Date:
October 21, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/02
Domestic Patent References:
| WO2016147381A1 | 2016-09-22 |
Foreign References:
| JPH05145281A | 1993-06-11 | |||
| JPH07329914A | 1995-12-19 | |||
| JP2001174229A | 2001-06-29 | |||
| JP2014041859A | 2014-03-06 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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