Title:
LEAD FRAME MATERIAL, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR PACKAGE USING LEAD FRAME MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/195267
Kind Code:
A1
Abstract:
The present invention provides: a lead frame material which has improved resin adhesion in a high-temperature high-humidity environment, while being capable of preventing fall-off of particles during processing; and the like. A lead frame material according to the present invention comprises a conductive base material and a surface coating film; and the surface coating film comprises a roughened layer. With respect to the surface of the surface coating film, if a first maximum height of roughness Rzx and an average length RSmx of first roughness curve elements are respectively measured in the transverse direction to the rolling direction, the transverse direction being orthogonal to the rolling direction of the conductive base material, and a second maximum height of roughness Rzy and an average length RSmy of second roughness curve elements are respectively measured in the parallel direction to the rolling direction, the parallel direction being parallel to the rolling direction of the conductive base material, and if X is the ratio Rzx/RSmx of the first maximum height of roughness Rzx to the average length RSmx of the first roughness curve elements, and Y is the ratio Rzy/RSmy of the second maximum height of roughness Rzy to the average length RSmy of the second roughness curve elements, the ratio X/Y is within the range of 1.20 to 2.00.
Inventors:
KUZUHARA SOKI (JP)
HASHIMOTO MAKOTO (JP)
OOUCHI KAZUHIRO (JP)
HASHIMOTO MAKOTO (JP)
OOUCHI KAZUHIRO (JP)
Application Number:
PCT/JP2023/007031
Publication Date:
October 12, 2023
Filing Date:
February 27, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA PREC ENGINEERING CO LTD (JP)
FURUKAWA PREC ENGINEERING CO LTD (JP)
International Classes:
H01L23/50; C25D5/10; C25D5/16; C25D7/00; C25D7/12
Domestic Patent References:
| WO2015029211A1 | 2015-03-05 | |||
| WO2018012297A1 | 2018-01-18 | |||
| WO2009044822A1 | 2009-04-09 |
Foreign References:
| JP2009226435A | 2009-10-08 | |||
| JP2014189856A | 2014-10-06 | |||
| JP2019112707A | 2019-07-11 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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