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Patent Searching and Data


Title:
LEAD FRAME PROCESSING COINING PUNCH, METHOD OF MANUFACTURING THE COINING PUNCH, AND LEAD FRAME
Document Type and Number:
WIPO Patent Application WO/2004/016368
Kind Code:
A1
Abstract:
A lead frame processing coining punch for processing a recessed groove in the surface of a lead frame, comprising a punch core part (2) having a punch tip part in contact with the surface of the lead frame at the time of processing and a hollow punch body part (3) having a coining processing part (9) for forming the recessed groove in the lead frame at the time of processing and a hollow part (10) in the axial direction of the punch, wherein the punch core part (2) is inserted into the hollow part (10) of the hollow punch body part (3), whereby even if the recessed groove is formed deep and narrow, the lead frame can withstand the processing without cracking.

Inventors:
SAKAE AKIRA (JP)
Application Number:
PCT/JP2003/009976
Publication Date:
February 26, 2004
Filing Date:
August 06, 2003
Export Citation:
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Assignee:
KOBE STEEL LTD (JP)
SAKAE AKIRA (JP)
International Classes:
B21D22/02; B21D37/02; B21D37/20; H01L21/00; H01L21/48; H01L23/50; (IPC1-7): B21D22/02; B21D22/04; B21D24/00; B21D37/02; B21J5/02; B21J13/02; H01L23/50
Foreign References:
JPS61190330U1986-11-27
JP2002143976A2002-05-21
JPH1133635A1999-02-09
JPH01306031A1989-12-11
JP2001246425A2001-09-11
US5192560A1993-03-09
JPH0621317A1994-01-28
JPH05211269A1993-08-20
JPH01125941A1989-05-18
Attorney, Agent or Firm:
Kotani, Etsuji (2-2 Nakanoshima 2-chome, Kita-k, Osaka-shi Osaka, JP)
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