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Title:
LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER
Document Type and Number:
WIPO Patent Application WO/2007/102589
Kind Code:
A1
Abstract:
Disclosed is a lead-free solder alloy excellent in impact resistance and vibration resistance. Also disclosed are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free solder alloy. Specifically disclosed is a lead-free solder alloy characterized by consisting of 1.0-2.0% by mass of Ag, 0.3-1.0% by mass of Cu, 0.005-0.10% by mass of Co, 0.0001-0.005% by mass of Fe and the balance of Sn and unavoidable impurities. By containing Co and Fe, a Cu atom site in a Cu6Sn5 intermetallic compound layer formed at the interface with the electrode is substituted with an atomic species having a smaller atomic radius than Cu, thereby reducing strain in the Cu6Sn5 intermetallic compound layer. Consequently, there can be prevented occurrence of a fracture at the interface between a Cu3Sn intermetallic compound layer and the Cu6Sn5 intermetallic compound layer.

Inventors:
SASAKI TSUTOMU (JP)
TANAKA MASAMOTO (JP)
KOBAYASHI TAKAYUKI (JP)
KAWAKAMI KAZUTO (JP)
FUJISHIMA MASAYOSHI (JP)
Application Number:
PCT/JP2007/054582
Publication Date:
September 13, 2007
Filing Date:
March 08, 2007
Export Citation:
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Assignee:
NIPPON STEEL MATERIALS CO LTD (JP)
NIPPON MICROMETAL CORP (JP)
SASAKI TSUTOMU (JP)
TANAKA MASAMOTO (JP)
KOBAYASHI TAKAYUKI (JP)
KAWAKAMI KAZUTO (JP)
FUJISHIMA MASAYOSHI (JP)
International Classes:
B23K35/26; C22C13/00; H05K3/34
Foreign References:
JP2005153007A2005-06-16
JP2002246742A2002-08-30
JP2002239780A2002-08-28
JP2001096394A2001-04-10
JP2003094195A2003-04-02
JPH1177366A1999-03-23
Attorney, Agent or Firm:
USHIKI, Mamoru (Yusei Fukushi Kotohira Bldg. 14-1, Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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