Title:
LEAD-FREE SOLDER ALLOY COMPOSITION AND METHOD FOR PREPARING LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2016/028058
Kind Code:
A1
Abstract:
The present invention relates to a lead-free solder alloy composition and a method for preparing the lead-free solder alloy. The lead-free solder alloy composition of the present invention comprises a ceramic powder added to the lead-free solder of Sn-(0.1-2) wt% Cu, Sn-(0.5-5) wt% Ag, Sn-(0.1-2) wt% and Cu-(0.5-5) wt% Ag. According to the present invention, provided is a new lead-free solder alloy composition which acts as a substitute for a traditional lead-free solder, and thus the lead-free solder alloy composition exhibits a more excellent effect than traditional solders in terms of spreadability, wettability, and mechanical properties.
Inventors:
SHARMA ASHUTOSH (KR)
SHARMA MUKESH (KR)
JUNG JAE PIL (KR)
YOON JONG HYUN (KR)
BAEK BUM GYU (KR)
SOHN HEUNG RAK (KR)
YIM SONG HEE (KR)
YOON JONG HYUK (KR)
SHARMA MUKESH (KR)
JUNG JAE PIL (KR)
YOON JONG HYUN (KR)
BAEK BUM GYU (KR)
SOHN HEUNG RAK (KR)
YIM SONG HEE (KR)
YOON JONG HYUK (KR)
Application Number:
PCT/KR2015/008611
Publication Date:
February 25, 2016
Filing Date:
August 18, 2015
Export Citation:
Assignee:
KYUNG DONG ONE CORP (KR)
LEE SEONG HOO (KR)
LEE SEONG HOO (KR)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| JP2005319470A | 2005-11-17 | |||
| JP2011025287A | 2011-02-10 | |||
| JP2008003669A | 2008-01-10 | |||
| KR20110026666A | 2011-03-16 |
Other References:
KI, WON MYOUNG ET AL.: "Nano-Composite Solder Technology for the improvement of Solder Joint Properties", JOURNAL OF THE MICROELECTRONICS & PACKAGING SOCIETY, vol. 18, no. 3., pages 9 - 17, XP009500224
See also references of EP 3184234A4
See also references of EP 3184234A4
Attorney, Agent or Firm:
KANG, Tae Hoon et al. (KR)
강태훈 (KR)
강태훈 (KR)
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