Title:
LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO2003004713
Kind Code:
A3
Abstract:
Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt.%. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder paste, thin sheet, ribbon foil, perform etc. The alloy has improved mechanical and electrical properties in comparison with conventional Tin-Lead alloys Sn9Zn and 63Sn37Pb.
Inventors:
KOPELIOVICH BARUCH (IL)
KAUFMAN ALBERTO (IL)
MAN YARON (IL)
KAUFMAN ALBERTO (IL)
MAN YARON (IL)
Application Number:
PCT/IL2002/000531
Publication Date:
March 04, 2004
Filing Date:
July 07, 2002
Export Citation:
Assignee:
IKA IND CONSULTING LTD (IL)
KOPELIOVICH BARUCH (IL)
KAUFMAN ALBERTO (IL)
MAN YARON (IL)
KOPELIOVICH BARUCH (IL)
KAUFMAN ALBERTO (IL)
MAN YARON (IL)
International Classes:
B23K35/26; C22C13/00; (IPC1-7): C22C13/00; B23K35/26
Foreign References:
| US2252409A | 1941-08-12 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 22 9 March 2001 (2001-03-09)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 22 9 March 2001 (2001-03-09)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05)
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