Title:
LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2006/129713
Kind Code:
A1
Abstract:
Disclosed is a lead-free solder alloy exhibiting improved drop impact resistance even after thermal aging while being good in soldering properties, void formation and discoloration. Specifically disclosed is a solder alloy consisting essentially of, in mass %, (1) 0.8-2.0% of Ag, (2) 0.05-0.3% of Cu, (3) one or more elements selected from not less than 0.01% and less than 0.1% of In, 0.01-0.04% of Ni, 0.01-0.05% of Co and 0.01-0.1% of Pt, and if necessary (4) one or more elements selected from Sb, Bi, Fe, Al, Zn and P in an amount of not more than 0.1% in total, and the balance of Sn and unavoidable impurities.
Inventors:
OHNISHI TSUKASA (JP)
YAMAKI TOKURO (JP)
SOMA DAISUKE (JP)
YAMAKI TOKURO (JP)
SOMA DAISUKE (JP)
Application Number:
PCT/JP2006/310882
Publication Date:
December 07, 2006
Filing Date:
May 31, 2006
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
OHNISHI TSUKASA (JP)
YAMAKI TOKURO (JP)
SOMA DAISUKE (JP)
OHNISHI TSUKASA (JP)
YAMAKI TOKURO (JP)
SOMA DAISUKE (JP)
International Classes:
C22C13/00; B23K35/26; H05K3/34
Foreign References:
| JP2004261863A | 2004-09-24 | |||
| JP2003094195A | 2003-04-02 | |||
| JP2002246742A | 2002-08-30 | |||
| JP2004330259A | 2004-11-25 | |||
| JP2005246480A | 2005-09-15 | |||
| JP2005103645A | 2005-04-21 | |||
| JP2005040847A | 2005-02-17 | |||
| JP2002307187A | 2002-10-22 | |||
| JP2002239780A | 2002-08-28 | |||
| JP2005046882A | 2005-02-24 |
Other References:
See also references of EP 1889684A4
Attorney, Agent or Firm:
Hirose, Shoichi (4-2 Nihonbashi Honcho 4-chom, Chuo-ku Tokyo 23, JP)
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