Title:
LEAD-FREE SOLDER BALL
Document Type and Number:
WIPO Patent Application WO/2014/002283
Kind Code:
A1
Abstract:
Provided is a solder ball that suppresses interfacial peeling at the bonding interface of the solder ball and suppresses non-fusion that occurs between the solder ball and a solder paste. The solder ball can be used for both a Ni electrode section having Au plating or the like, and a Cu electrode section having a water-soluble organic solderability preservative coated on Cu. This invention pertains to a lead-free solder ball for electrodes for BGA and CSP, having 1.6-2.9 mass% Ag, 0.7-0.8 mass% Cu, 0.05-0.08 mass% Ni, and the remainder comprising Sn. The lead-free solder ball has both excellent heat fatigue resistance and excellent drop impact resistance, even when the bonded printed circuit board is a Cu electrode or is a Ni electrode using Au plating or Au/Pd plating in the surface treatment thereof. In addition, a total of 0.003-0.1 mass% of at least one type of element selected from among Fe, Co, and Pt or a total of 0.003-0.1 mass% of at least one type of element selected from Bi, In, Sb, P, and Ge can be added to this composition.
Inventors:
YAMANAKA YOSHIE (JP)
TACHIBANA KEN (JP)
YOSHIKAWA SHUNSAKU (JP)
NOMURA HIKARU (JP)
TACHIBANA KEN (JP)
YOSHIKAWA SHUNSAKU (JP)
NOMURA HIKARU (JP)
Application Number:
PCT/JP2012/066822
Publication Date:
January 03, 2014
Filing Date:
June 30, 2012
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
YAMANAKA YOSHIE (JP)
TACHIBANA KEN (JP)
YOSHIKAWA SHUNSAKU (JP)
NOMURA HIKARU (JP)
YAMANAKA YOSHIE (JP)
TACHIBANA KEN (JP)
YOSHIKAWA SHUNSAKU (JP)
NOMURA HIKARU (JP)
International Classes:
C22C13/00; B23K35/26; C22C13/02; H01L21/60; H05K3/34
Domestic Patent References:
| WO2007102589A1 | 2007-09-13 | |||
| WO2006134891A1 | 2006-12-21 | |||
| WO2006129713A1 | 2006-12-07 | |||
| WO2007081006A1 | 2007-07-19 | |||
| WO2007102588A1 | 2007-09-13 |
Foreign References:
| JP2008518791A | 2008-06-05 | |||
| JP2003290974A | 2003-10-14 | |||
| JP2002246742A | 2002-08-30 | |||
| JPH10118783A | 1998-05-12 | |||
| JP2002076605A | 2002-03-15 | |||
| JP2007237252A | 2007-09-20 | |||
| JP2001096394A | 2001-04-10 | |||
| JP2000288772A | 2000-10-17 | |||
| JP2002239780A | 2002-08-28 |
Other References:
See also references of EP 2886243A4
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