Title:
LEAD-FREE SOLDER BUMP JOINING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/084550
Kind Code:
A1
Abstract:
Provided is a lead-free solder bump joining structure. In the present invention, intermetallic compound layers (11, 12) are resistant to loss as a result of the suppression of diffusion of Cu from the intermetallic compound layers (11, 12) which are formed at the junction interface with Cu electrodes (4, 7) within a lead-free solder bump (10), and Cu is less likely to diffuse into the lead-free solder bump (10) from the Cu electrodes (4, 7) due to the intermetallic compound layers (11, 12). As a result of the foregoing, even if current continues to flow between a first electronic member (2) and a second electronic member (5) via the lead-free solder bump (10), the occurrence of the electromigration phenomena and the thermomigration phenomena can be suppressed, and thus disconnection failure arising due to the synergistic effect of the electromigration phenomena and the thermomigration phenomena can be suppressed.
More Like This:
Inventors:
ISHIKAWA SHINJI (JP)
TERASHIMA SHINICHI (JP)
AKASHI KEISUKE (JP)
TERASHIMA SHINICHI (JP)
AKASHI KEISUKE (JP)
Application Number:
PCT/JP2015/080647
Publication Date:
June 02, 2016
Filing Date:
October 30, 2015
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN MAT CO (JP)
NIPPON MICROMETAL CORP (JP)
NIPPON MICROMETAL CORP (JP)
International Classes:
B23K35/26; B23K1/19; B23K1/20; C22C13/00; C22C13/02; H01L21/60
Domestic Patent References:
| WO2007102588A1 | 2007-09-13 | |||
| WO2012115268A1 | 2012-08-30 |
Foreign References:
| JP2014027122A | 2014-02-06 | |||
| JP2003303842A | 2003-10-24 | |||
| JPH01283398A | 1989-11-14 |
Attorney, Agent or Firm:
YOSHIDA TADANORI (JP)
Yoshida Justice (JP)
Yoshida Justice (JP)
Download PDF: