Title:
LEAD-FREE SOLDER FLUX and SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2006/070797
Kind Code:
A1
Abstract:
A lead-free solder flux which can reduce generation of bubble voids and cavity voids without deteriorating normal soldering characteristics of solder balls and the like. The lead-free solder flux contains a polyhydric alcohol ester (a1) of resin acids as a base resin (A) by 6-55%. Further, a solder paste which contains the lead-free solder flux and a lead-free solder powder and remarkably reduces generation of void is provided.
Inventors:
ISHIGA FUMIO (JP)
CHIBA YASUO (JP)
KAJITA KAZUSHIGE (JP)
CHIBA YASUO (JP)
KAJITA KAZUSHIGE (JP)
Application Number:
PCT/JP2005/023890
Publication Date:
July 06, 2006
Filing Date:
December 27, 2005
Export Citation:
Assignee:
ARAKAWA CHEM IND (JP)
ISHIGA FUMIO (JP)
CHIBA YASUO (JP)
KAJITA KAZUSHIGE (JP)
ISHIGA FUMIO (JP)
CHIBA YASUO (JP)
KAJITA KAZUSHIGE (JP)
International Classes:
B23K35/363; B23K35/22; H05K3/34; B23K35/26; C22C13/00
Foreign References:
| JPH07185882A | 1995-07-25 | |||
| JP2002120090A | 2002-04-23 | |||
| JPH071182A | 1995-01-06 | |||
| JPH0639584A | 1994-02-15 | |||
| JPH10230389A | 1998-09-02 |
Other References:
See also references of EP 1834728A4
Attorney, Agent or Firm:
Asahina, Sohta (2-22 Tanimachi 2-chome, Chuo-ku, Osaka-sh, Osaka 12, JP)
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