Title:
LEAD-FREE SOLDER AND ITS PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2007/079671
Kind Code:
A1
Abstract:
The invention relates to lead-free solder and a preparing method thereof. The
solder comprises 0.1 -4.0 wt% Cu 0.001 -0.5 wt% Ni 0.1 -6.0 wt% Ag 0.0001 -0.1 wt%
P or Ga and a balance of Sn. According to the present invention, raw materials with
high purity is used in the preparation of the solder, thus , the loss of metal is
reduced, metallurgical structure is much more uniform, and the grain is refined.
Also the wettability of the solder and the welding performance are improved.
The present solder is preferred to be used in welding of wires or transformer.
Inventors:
HUANG SHOUYOU (CN)
Application Number:
PCT/CN2007/000033
Publication Date:
July 19, 2007
Filing Date:
January 08, 2007
Export Citation:
Assignee:
THOUSAND ISLAND METAL FOIL CO (CN)
HUANG SHOUYOU (CN)
HUANG SHOUYOU (CN)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| KR20050030237A | 2005-03-29 | |||
| CN1329964A | 2002-01-09 | |||
| CN1195592A | 1998-10-14 | |||
| CN1314229A | 2001-09-26 | |||
| JP2001071173A | 2001-03-21 |
Attorney, Agent or Firm:
CHANGSHA ZONEKEY PATENTLAW FIRM (Changsha, Hunan 1, CN)
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