Title:
LEAD-FREE SOLDER AND ITS PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2007/082459
Kind Code:
A1
Abstract:
The invention relates to a lead-free solder and a preparing method thereof. The solder
comprises 0.1 -5.0 wt% Cu 0.001 -0.5 wt% Ni, 0.0001 -0.1 wt% P or Ga and a balance of
Sn. According to the present invention, raw materials with high purity is used in
the preparation of the solder, thus , the loss of metal is reduced, metallurgical structure
is much more uniform, and the grain is refined. Also the wettability of the solder
and the welding performance are improved. The present solder is preferred to
be used in welding of wires or transformer.
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Inventors:
HUANG SHOUYOU (CN)
Application Number:
PCT/CN2007/000032
Publication Date:
July 26, 2007
Filing Date:
January 08, 2007
Export Citation:
Assignee:
THOUSAND ISLAND METAL FOIL CO (CN)
HUANG SHOUYOU (CN)
HUANG SHOUYOU (CN)
International Classes:
B23K35/26; C22C13/00
Foreign References:
KR20040035458A | 2004-04-29 | |||
KR100395438B1 | 2003-08-21 | |||
US6296722B1 | 2001-10-02 | |||
JP2006026745A | 2006-02-02 | |||
JP2002018589A | 2002-01-22 |
Attorney, Agent or Firm:
CHANGSHA ZONEKEY PATENTLAW FIRM (Changsha, Hunan 1, CN)
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