Title:
LEAD-FREE SOLDER AND SOLDERED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2004/039533
Kind Code:
A1
Abstract:
A Sn-Zn based lead-free solder which contains 5 to 10 mass % of Zn, 0.005 to 1.0 mass % in total of one or more selected from the group consisting of Au, Pt, Pd, Fe and Sb, optionally 15 mass % or less of one or more selected from the group consisting of Bi and In, and the balanced amount of Sn. The Sn-Zn based lead-free solder is free from the exfoliation thereof from a soldered portion of an article after an elapse of a long period from the time of soldering, even when the soldered portion is made of copper and it is used as a solder paste using a rosin-based flux containing a halogen compound such as an amine-hydrogen chloride salt as an activator.
Inventors:
HIRATA MASAHIKO (JP)
YOSHIDA HISAHIKO (JP)
NAGASHIMA TAKASHI (JP)
YOSHIDA HISAHIKO (JP)
NAGASHIMA TAKASHI (JP)
Application Number:
PCT/JP2003/013996
Publication Date:
May 13, 2004
Filing Date:
October 31, 2003
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
MATSUSHITA ELECTRIC IND CO LTD (JP)
HIRATA MASAHIKO (JP)
YOSHIDA HISAHIKO (JP)
NAGASHIMA TAKASHI (JP)
TAGUCHI TOSHIHIKO (JP)
TOYODA YOSHITAKA (JP)
OHNISHI TSUKASA (JP)
MATSUSHITA ELECTRIC IND CO LTD (JP)
HIRATA MASAHIKO (JP)
YOSHIDA HISAHIKO (JP)
NAGASHIMA TAKASHI (JP)
TAGUCHI TOSHIHIKO (JP)
TOYODA YOSHITAKA (JP)
OHNISHI TSUKASA (JP)
International Classes:
B23K35/22; B23K35/26; C22C13/00; C22C13/02; H05K3/34; (IPC1-7): B23K35/26
Foreign References:
| JPH0919790A | 1997-01-21 | |||
| JPH0985484A | 1997-03-31 | |||
| EP0622151A1 | 1994-11-02 | |||
| JPH09174278A | 1997-07-08 | |||
| JPH08243782A | 1996-09-24 | |||
| EP0855242A1 | 1998-07-29 | |||
| JP2000015478A | 2000-01-18 | |||
| JPS59189096A | 1984-10-26 | |||
| EP0649703A1 | 1995-04-26 |
Other References:
See also references of EP 1557235A4
Attorney, Agent or Firm:
Hirose, Shoichi (4-2 Nihonbashi Honcho 4-chom, Chuo-ku Tokyo, JP)
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