Title:
LEAD SUPPORT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/170750
Kind Code:
A1
Abstract:
A lead support device (1) comprises: a rail (11) positioned with respect to an object (20) and extending in a first direction (X); a movable part (12) that can move along the rail (11) in the first direction (X); a support part (13) that is fixed to the movable part (12) and that supports a lead wire (30); and a fixed part (15) that is switchable among a first state in which the movable part (12) is fixed to a first position of the rail (11), a second state in which the movable part (12) is not fixed to the the rail (11), and a third state in which the movable part is fixed to a second position of the rail apart from the first position in the first direction (X).
Inventors:
OKADA SHUNSAKU (JP)
KISHI NORIYUKI (JP)
KISHI NORIYUKI (JP)
Application Number:
PCT/JP2022/009754
Publication Date:
September 14, 2023
Filing Date:
March 07, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K7/00
Foreign References:
| JP2005318729A | 2005-11-10 | |||
| JP2001190015A | 2001-07-10 | |||
| JPH066049A | 1994-01-14 | |||
| JP2008153283A | 2008-07-03 | |||
| CN208623249U | 2019-03-19 | |||
| CN214379905U | 2021-10-08 | |||
| JP2013145804A | 2013-07-25 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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