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Patent Searching and Data


Title:
LEAD WIRE CUTTING UNIT AND MOUNTER PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2019/220499
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of improving a lead wire cutting unit and a mounter provided with the lead wire cutting unit, for example, making it possible to satisfactorily cut a plurality of lead wires of a lead component. In a lead wire cutting unit according to the present disclosure, one or more of a plurality of cutting blade holding members that hold a plurality of cutting blades are each provided with at least one reference mark. In addition, since the relative positions of the at least one reference mark and the one or more cutting blades are determined in advance, when the position of the reference mark is acquired, the positions of the one or more cutting blades are determined on the basis of the position and the relative positions of the reference marks. Consequently, it is possible to improve the positioning accuracy of the plurality of lead wires and the one or more cutting blades and to satisfactorily cut the plurality of lead wires.

Inventors:
CHI XIAODONG (JP)
NONOMURA TOSHIHIRO (JP)
Application Number:
PCT/JP2018/018533
Publication Date:
November 21, 2019
Filing Date:
May 14, 2018
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
B21F11/00; B23D17/00; B23Q17/22; B23Q17/24; H05K13/04
Foreign References:
JP2017034169A2017-02-09
JP2018046045A2018-03-22
JP2018043298A2018-03-22
JP2004182359A2004-07-02
JP2017034169A2017-02-09
Other References:
See also references of EP 3795271A4
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
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