Title:
LEAD WIRE JOINING METHOD, LEAD WIRE JOINING DEVICE, AND PRESS MOLD
Document Type and Number:
WIPO Patent Application WO/2016/063657
Kind Code:
A1
Abstract:
Provided are a lead wire joining method, a lead wire joining device, and a press mold, excelling in productivity, and wherein unraveling does not occur with respect to a plurality of conducting wires in a lead wire. A lead wire 1 comprising a plurality of conducting wires is joined with a terminal 2 by resistance welding. The lead wire joining method includes: a juxtaposition step of juxtaposing a terminal (2) and a plurality of conducting wires in a lead wire (1); and an integration step of integrally pressure welding the plurality of conducting wires (1a) and the terminal (2), by compressing the plurality of conducting wires in a plurality of lead wires 1 from at least two mutually different axial directions, in a first mold (11) and a second mold (12) which are separable.
Inventors:
ISHIGA DAISUKE (JP)
Application Number:
PCT/JP2015/076097
Publication Date:
April 28, 2016
Filing Date:
September 15, 2015
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01R43/02; B23K11/00; B23K11/11
Domestic Patent References:
| WO2010026173A1 | 2010-03-11 | |||
| WO2008152000A1 | 2008-12-18 |
Foreign References:
| JP2011060524A | 2011-03-24 | |||
| JPH08264256A | 1996-10-11 |
Attorney, Agent or Firm:
MASUI, Yoshihisa et al. (JP)
Yoshihisa Masui (JP)
Yoshihisa Masui (JP)
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