LEADLESS SOLDER - NIHON SUPERIOR SHA CO LTD

Title:

LEADLESS SOLDER

Document Type and Number:

WIPO Patent Application WO/1999/048639

Kind Code:

A1

Abstract:

Ternary leadless solder comprising l-2 wt.% of Cu, 0.002-l wt.% of Ni, and Sn for the rest, wherein the contents of Cu and Ni are preferably 0.3-0.7 wt.% and 0.04-0.l wt.% respectively, a method of adding Ni to a Sn-Cu alloy and a method of adding Cu to a Sn-Ni alloy being employed.

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Inventors:

NISHIMURA TETSURO (JP)

Application Number:

PCT/JP1999/001229

Publication Date:

September 30, 1999

Filing Date:

March 15, 1999

Export Citation:

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Assignee:

NIHON SUPERIOR SHA CO LTD (JP)
NISHIMURA TETSURO (JP)

International Classes:

B23K35/26; C22C13/00; H05K1/09; H05K3/34; B23K; C22C; (IPC1-7): B23K35/26; C22C13/00

Foreign References:

JPH0234295A	1990-02-05
JPH10180481A	1998-07-07

Other References:

"Dai 4 Kai Electronics ni Okeru Micro Ketsugou Jissou Gijutsu Symposium Rombunshuu", issued by THE JAPAN WELDING SOCIETY, 29 January 1998, pp. 285-288.
See also references of EP 0985486A4

Attorney, Agent or Firm:

Hamada, Toshiaki (Seiiku 5-chome Joto-ku Osaka-shi Osaka, JP)

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