Title:
LEAK PROOF PAD FOR CMP ENDPOINT DETECTION
Document Type and Number:
WIPO Patent Application WO/2011/008499
Kind Code:
A3
Abstract:
In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not entirely through the polishing layer, and a solid light-transmissive window is secured in the recess. In another aspect, a polishing pad includes a polishing layer having a polishing surface, and the polishing surface includes a first region having a first plurality of grooves with a first depth extending partially but not entirely through the polishing layer and a second region surrounded by the first region and having a second plurality of grooves with a second depth extending partially but not entirely through the polishing layer, the second depth greater than the first depth.
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Inventors:
PAIK YOUNG J (US)
MAHON CHRISTOPHER R (US)
BHATNAGAR ASHISH (US)
NARENDRNATH KADTHALA RAMAYA (US)
MAHON CHRISTOPHER R (US)
BHATNAGAR ASHISH (US)
NARENDRNATH KADTHALA RAMAYA (US)
Application Number:
PCT/US2010/040238
Publication Date:
March 31, 2011
Filing Date:
June 28, 2010
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
PAIK YOUNG J (US)
MAHON CHRISTOPHER R (US)
BHATNAGAR ASHISH (US)
NARENDRNATH KADTHALA RAMAYA (US)
PAIK YOUNG J (US)
MAHON CHRISTOPHER R (US)
BHATNAGAR ASHISH (US)
NARENDRNATH KADTHALA RAMAYA (US)
International Classes:
H01L21/304; B24B37/04; B24B49/12
Foreign References:
| US20070077862A1 | 2007-04-05 | |||
| US7306507B2 | 2007-12-11 | |||
| KR20050051094A | 2005-06-01 | |||
| KR20040108008A | 2004-12-23 |
Attorney, Agent or Firm:
GOREN, David J. (P.O. Box 1022Minneapolis, Minnesota, US)
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