Title:
LED CHIP ASSEMBLY, DISPLAY PANEL, AND PREPARATION METHODS
Document Type and Number:
WIPO Patent Application WO/2022/088592
Kind Code:
A1
Abstract:
An LED chip assembly (10), and a display panel (70) and a preparation method, wherein the LED chip assembly (10) comprises a donor, multiple LED chips (12) located on the donor, and at least two mark basis parts (13), the mark basis parts (13) and the LED chips (12) being formed on the same growth donor (11), and the mark basis parts (13) being able to be transferred to a transient donor (31) together with the LED chips (12) to play a positioning function during the transfer of the LED chips (12).
Inventors:
QI YANGYANG (CN)
YEN CHIA-HUANG (CN)
CHENG HAO-KU (CN)
HU YING (CN)
WANG HUIPING (CN)
YEN CHIA-HUANG (CN)
CHENG HAO-KU (CN)
HU YING (CN)
WANG HUIPING (CN)
Application Number:
PCT/CN2021/082161
Publication Date:
May 05, 2022
Filing Date:
March 22, 2021
Export Citation:
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)
International Classes:
H01L23/544
Foreign References:
| US20190157501A1 | 2019-05-23 | |||
| CN109326549A | 2019-02-12 | |||
| CN105374726A | 2016-03-02 | |||
| CN110310907A | 2019-10-08 | |||
| CN111627952A | 2020-09-04 |
Attorney, Agent or Firm:
DHC IP ATTORNEYS (CN)
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