Title:
LED ENCAPSULATION STRUCTURE AND LED DIE BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/017562
Kind Code:
A1
Abstract:
Provided in the present application is an LED encapsulation structure and an LED die bonding method. The LED encapsulation structure comprises a support, a vertical structure chip, a first conductive wire, and a second conductive wire. The support comprises a first electrode plate, a second electrode plate, and a base. A first solder pad and a second solder pad are provided on the first electrode plate, and a third solder pad is provided on the second electrode plate. In the LED encapsulation structure and the LED die bonding method provided in the present application, by means of arranging a first solder pad and a second solder pad at an interval on a first electrode plate and using a first conductive wire for soldering a connection between the first solder pad and the second solder pad, and fixing a vertical structure chip on the first solder pad, the vertical structure chip can be effectively prevented from being separated from the first electrode plate in special environments (such as high temperature, high humidity, or hot and cold environments), and the hot and cold impact resistance and vulcanization resistance performance of the LED encapsulation structure is effectively improved, in order to ensure the reliability of the connection between the vertical structure chip and the first electrode plate, thus effectively improving the reliability of the LED encapsulation structure.
Inventors:
CHEN LEI (CN)
LI XUEWEN (CN)
LIN JINTIAN (CN)
CAI JILONG (CN)
LI JIAN (CN)
TAN JUN (CN)
LI XUEWEN (CN)
LIN JINTIAN (CN)
CAI JILONG (CN)
LI JIAN (CN)
TAN JUN (CN)
Application Number:
PCT/CN2020/089167
Publication Date:
February 04, 2021
Filing Date:
May 08, 2020
Export Citation:
Assignee:
XUYU OPTOELECTRONICS SHENZHEN CO LTD (CN)
International Classes:
H01L33/48
Foreign References:
| KR20120069290A | 2012-06-28 | |||
| CN201204212Y | 2009-03-04 | |||
| CN209150142U | 2019-07-23 | |||
| CN201681969U | 2010-12-22 | |||
| CN201562690U | 2010-08-25 | |||
| CN108598246A | 2018-09-28 |
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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