Title:
LED HEAT-DISSIPATION FLEXIBLE MODULE USING CARBON FIBER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/104559
Kind Code:
A1
Abstract:
The present invention relates to a high heat-dissipation printed circuit board and a method for manufacturing the same, the circuit board comprising: a heat-dissipation layer comprising carbon fiber fabrics; an insulation layer formed on the heat-dissipation layer; a wiring layer formed on the insulation layer and patterned by a printing method of a conductive paste composite; and a metal plating layer formed on the patterned wiring layer. Since the high heat-dissipation printed circuit board, according to the present invention, can have relatively improved heat-dissipation, light-weightness and flexibility characteristics, the high heat-dissipation printed circuit board can be applied to an LED heat-dissipation flexible module.
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Inventors:
CHOI EUN KUK (KR)
CHOO JOUNG HOON (KR)
CHOO JOUNG HOON (KR)
Application Number:
PCT/KR2013/009815
Publication Date:
July 03, 2014
Filing Date:
November 01, 2013
Export Citation:
Assignee:
HICEL CO LTD (KR)
International Classes:
H05K7/20; H05K1/02; H05K3/12
Foreign References:
| JP2006165299A | 2006-06-22 | |||
| JP2001044332A | 2001-02-16 | |||
| JPH08181261A | 1996-07-12 | |||
| KR20060100142A | 2006-09-20 | |||
| JP2011061157A | 2011-03-24 |
Attorney, Agent or Firm:
LEE, SI GEUN (KR)
이시근 (KR)
이시근 (KR)
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