Title:
LED MODULE
Document Type and Number:
WIPO Patent Application WO/2013/179626
Kind Code:
A1
Abstract:
An LED module is provided with a translucent light-diffusing substrate, an LED chip that is joined via a transparent first joining section to one surface side of the light-diffusing substrate, a light conversion section that covers the LED chip at the abovementioned surface side of the light-diffusing substrate, and a mounting substrate. The color conversion section is made from a transparent material containing a fluorescent substance that is excited by the light emitted from the LED chip and that emits lights of a different color than that of the LED chip. The mounting substrate comprises a diffuse reflection layer that diffusely reflects light emitted from the LED chip and light emitted from the fluorescent substance. The diffuse reflection layer is arranged on the other surface side of the light-diffusing substrate.
Inventors:
URANO YOJI
NAKAMURA AKIFUMI
IOKA HAYATO
IMAI RYOJI
GODA JUN
HIRANO TORU
SUZUKI MASANORI
HYUGA HIDEAKI
NAKAMURA AKIFUMI
IOKA HAYATO
IMAI RYOJI
GODA JUN
HIRANO TORU
SUZUKI MASANORI
HYUGA HIDEAKI
Application Number:
PCT/JP2013/003303
Publication Date:
December 05, 2013
Filing Date:
May 24, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H01L33/60
Domestic Patent References:
WO2012039442A1 | 2012-03-29 |
Foreign References:
JP2005209958A | 2005-08-04 | |||
JP2009123908A | 2009-06-04 | |||
JP2011086419A | 2011-04-28 | |||
JP2007059781A | 2007-03-08 | |||
JP2001284656A | 2001-10-12 | |||
JP2007287713A | 2007-11-01 | |||
JP2007109701A | 2007-04-26 |
Other References:
See also references of EP 2858132A4
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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