Title:
LEVELING AGENT, METAL PLATING COMPOSITION CONTAINING SAME, PREPARATION METHOD THEREFOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/019532
Kind Code:
A1
Abstract:
Disclosed are a leveling agent, a metal plating composition containing same, and a preparation method therefor and the use thereof. The raw materials of the metal electroplating composition comprise a metal plating solution and a leveling agent; the metal plating solution comprises a copper salt, an acidic electrolyte, a source of halide ions and water; and the leveling agent is a compound of formula I. The metal plating composition can be used in the processes of printed circuit board electroplating and integrated circuit copper interconnection electroplating, can achieve the effects of no voids and defects, low purity in the plating layer, good plating homogeneity, a dense structure and small surface roughness, and has better industrial application value.
Inventors:
WANG SU (CN)
SHI LIQI (CN)
GAO XUEPENG (CN)
SHI LIQI (CN)
GAO XUEPENG (CN)
Application Number:
PCT/CN2017/116441
Publication Date:
January 31, 2019
Filing Date:
December 15, 2017
Export Citation:
Assignee:
SHANGHAI SINYANG SEMICONDUCTOR MAT CO LTD (CN)
International Classes:
C25D3/38; C07D487/04
Domestic Patent References:
| WO2007135380A2 | 2007-11-29 | |||
| WO2009034386A1 | 2009-03-19 |
Foreign References:
| CN107313082A | 2017-11-03 | |||
| CN107217283A | 2017-09-29 | |||
| CN106432247A | 2017-02-22 | |||
| CN105683250A | 2016-06-15 | |||
| CN102276796A | 2011-12-14 |
Attorney, Agent or Firm:
SHANGHAI BESHINING LAW OFFICE (CN)
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