Title:
LID FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2021/065672
Kind Code:
A1
Abstract:
This lid for an electronic device has a through hole that penetrates a first surface and a second surface. Also, in the cross section that includes the penetration axis of the through hole, the inner wall facing the through hole has a plurality of long particles for which the longitudinal direction is along the penetration axis.
Inventors:
YAMASAKI SHO (JP)
Application Number:
PCT/JP2020/036037
Publication Date:
April 08, 2021
Filing Date:
September 24, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02
Foreign References:
| JP2016139731A | 2016-08-04 | |||
| JP2007178133A | 2007-07-12 | |||
| JP2016100403A | 2016-05-30 | |||
| JPH0246100A | 1990-02-15 | |||
| JP2012090332A | 2012-05-10 |
Other References:
See also references of EP 4040477A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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