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Patent Searching and Data


Title:
LID FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2021/065672
Kind Code:
A1
Abstract:
This lid for an electronic device has a through hole that penetrates a first surface and a second surface. Also, in the cross section that includes the penetration axis of the through hole, the inner wall facing the through hole has a plurality of long particles for which the longitudinal direction is along the penetration axis.

Inventors:
YAMASAKI, Sho (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, JP)
Application Number:
JP2020/036037
Publication Date:
April 08, 2021
Filing Date:
September 24, 2020
Export Citation:
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Assignee:
KYOCERA CORPORATION (Fushimi-ku Kyoto-sh, Kyoto 01, JP)
International Classes:
H01L23/02
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (17F. Tokyo Takarazuka Bldg., 1-1-3, Yurakucho, Chiyoda-k, Tokyo 06, JP)
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