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Patent Searching and Data


Title:
LID MEMBER, METHOD FOR MANUFACTURING LID MEMBER, PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/004390
Kind Code:
A1
Abstract:
A lid member 4 is provided with a body section 7, a buffer film 8 formed on a surface 7a of the body section 7, and a bonding section 10 formed so as to overlap with the buffer film 8. The bonding section 10 includes a metal bonding material. The buffer film 8 includes an oxide film.

Inventors:
MASHIMA RYOTA (JP)
Application Number:
PCT/JP2021/022889
Publication Date:
January 06, 2022
Filing Date:
June 16, 2021
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
H01L23/02; H01L33/52
Domestic Patent References:
WO2020071452A12020-04-09
Foreign References:
JP2018037581A2018-03-08
JP2002334943A2002-11-22
JP2004207539A2004-07-22
JP2008118585A2008-05-22
JP2009200093A2009-09-03
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
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