Title:
LIGHT-CURING RESIN COMPOSITION, AND PLUMBING MEMBER AND FUNCTIONAL PANEL USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/011693
Kind Code:
A1
Abstract:
Provided is a light-curing resin composition that exhibits improved characteristics such as slipperiness. This light-curing resin composition contains the following: a (A) dimethyl silicone (meth)acrylate oligomer obtained by reacting (a) a silicone polyol represented by general formula (1), (b) isocyanate, and a (c) (meth)acrylate monomer that has a terminal functional group that can react with isocyanate; a (B) photopolymerizable oligomer and/or (C) photopolymerizable monomer that can copolymerize with the aforementioned (A) dimethyl silicone (meth)acrylate oligomer; a (D) fluorine-containing compound; and a (E) photopolymerization initiator. In general formula (1), n represents an integer selected discretionarily so as to bring the number-average molecular weight of the (A) dimethyl silicone (meth)acrylate oligomer to between 700 and 40,000, inclusive; and R represents a C1-30 alkylene group or a C1-30 functional group having an ether bond.
Inventors:
ISHIHARA TAKENOBU (JP)
Application Number:
PCT/JP2012/004602
Publication Date:
January 24, 2013
Filing Date:
July 19, 2012
Export Citation:
Assignee:
BRIDGESTONE CORP (JP)
ISHIHARA TAKENOBU (JP)
ISHIHARA TAKENOBU (JP)
International Classes:
C08F290/06; C08F299/06; C09D4/02; C09D7/12; C09D175/16; C09D183/07
Foreign References:
| JP2008044979A | 2008-02-28 | |||
| JP2010111800A | 2010-05-20 | |||
| JP2004037811A | 2004-02-05 | |||
| JP2002284828A | 2002-10-03 | |||
| JP2001188101A | 2001-07-10 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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Claims:
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