LIGHT-CURING RESIN COMPOSITION - NISSAN CHEMICAL IND LTD

Title:

LIGHT-CURING RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2013/047435

Kind Code:

A1

Abstract:

[Problem] To provide an adhesive composition which exhibits high adhesiveness to a poor adherend of a light-curing resin composition, such as glass, copper, aluminum, PET, or PC, and which also exhibits high adhesiveness even between dissimilar adherends. [Solution] A light-curing resin composition including a polyene compound represented by formula (1) (In the formula, n1, n2, and n3 each independently represent an integer 2-4. R1-R9 each independently represent a hydrogen atom or a C1-10 alkyl group.). Further included is a thiol compound. The thiol compound is a compound having 2-6 thiol groups in a molecule. The thiol compound is an aliphatic thiol. The thiol compound is obtained by a reaction between an aliphatic mercapto carboxylic acid and a polyhydric alcohol. The polyhydric alcohol is an aliphatic polyhydric alcohol or hydroxyalkyl isocyanurate. Also included is a photopolymerization initiator.

Inventors:

OHMORI KENTARO (JP)
MORO TAKEO (JP)
ENDO YUKI (JP)

Application Number:

PCT/JP2012/074389

Publication Date:

April 04, 2013

Filing Date:

September 24, 2012

Export Citation:

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Assignee:

NISSAN CHEMICAL IND LTD (JP)

International Classes:

C08G75/04; C09J4/00

Domestic Patent References:

WO2011093188A1	2011-08-04
WO2011093236A1	2011-08-04
WO2010092947A1	2010-08-19

Foreign References:

JP2011225880A	2011-11-10
JP2006012784A	2006-01-12
JP2005139401A	2005-06-02
JP2011052148A	2011-03-17
JPH03243626A	1991-10-30
JPH073025A	1995-01-06
JP2001194510A	2001-07-19
JP2002182002A	2002-06-26
JP2003277505A	2003-10-02
JPS6320255B2	1988-04-27
JPH06306172A	1994-11-01
JP2001026608A	2001-01-30
JP2009007430A	2009-01-15

Other References: