Title:
LIGHT-EMITTING DEVICE PRODUCTION METHOD AND PRODUCTION DEVICE, AND LASER ELEMENT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/153476
Kind Code:
A1
Abstract:
A light-emitting device production method comprising: a step for preparing a first substrate having a plurality of light-emitting bodies; a step for preparing a second substrate having a conductive first bond section, a first pad section electrically connected to the first bond section, and a first solder restricting section positioned between the first bond section and the first pad section, with solder being formed upon the first bond section; a step for bonding, by means of the solder, the second substrate and a first target body selected from the plurality of light-emitting bodies; and a step for transferring the first target body to the second substrate by separating the first and second substrates.
Inventors:
KAWAGUCHI YOSHINOBU (JP)
MURAKAWA KENTARO (JP)
KAMIKAWA TAKESHI (JP)
MURAKAWA KENTARO (JP)
KAMIKAWA TAKESHI (JP)
Application Number:
PCT/JP2023/004376
Publication Date:
August 17, 2023
Filing Date:
February 09, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01S5/0237; H01L33/62
Foreign References:
| US20220029051A1 | 2022-01-27 | |||
| JP2017130589A | 2017-07-27 | |||
| JP2006332521A | 2006-12-07 | |||
| JPS5749284A | 1982-03-23 | |||
| JP2020043253A | 2020-03-19 | |||
| JPH10242149A | 1998-09-11 | |||
| JP2002169064A | 2002-06-14 | |||
| JP2011166068A | 2011-08-25 | |||
| JPS63157969U | 1988-10-17 | |||
| JP2008252069A | 2008-10-16 | |||
| US20210175390A1 | 2021-06-10 | |||
| US6485993B2 | 2002-11-26 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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