Title:
LIGHT-EMITTING DIODE DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/203355
Kind Code:
A1
Abstract:
Disclosed are a light-emitting diode device and a production method therefor. The present invention is not only suitable for light-emitting diode devices having vertical structures, but also suitable for other series of light-emitting diode devices having horizontal structures, high-voltage structures, etc. The light-emitting diode device comprises a substrate and a plurality of mesa structures located on the upper surface of the substrate; the mesa structures comprise light-emitting diode mesas located in light-emitting areas and cutting area mesas located in cutting areas; the light-emitting diode mesas and the cutting area mesas are arranged alternately; the cutting area comprises a cutting channel and a spacing area; a reflective metal layer, a sacrificial layer, and a first insulating layer inside the cutting channel are distributed in a trapezoidal shape; such a trapezoidal distribution effectively improves the continuous direction of stress at the cutting channel and reduces continuous accumulation of stress. Therefore, stress lines and the abnormality that a semiconductor epitaxial layer is prone to peel off and fall off are reduced or eliminated, the appearance yield of the light-emitting diode device can be effectively improved, and the product quality of the light-emitting diode device is improved.
Inventors:
CAI LINRONG (CN)
YANG LIXUN (CN)
TSENG HSIN-YI (CN)
ZHU LIQIN (CN)
YANG LIXUN (CN)
TSENG HSIN-YI (CN)
ZHU LIQIN (CN)
Application Number:
PCT/CN2020/083931
Publication Date:
October 14, 2021
Filing Date:
April 09, 2020
Export Citation:
Assignee:
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L33/24; H01L27/32
Domestic Patent References:
WO2013046545A1 | 2013-04-04 |
Foreign References:
CN202839726U | 2013-03-27 | |||
CN107742476A | 2018-02-27 | |||
CN109360843A | 2019-02-19 | |||
CN109860369A | 2019-06-07 |
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