LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME

Title:

LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME

Document Type and Number:

WIPO Patent Application WO/2013/062289

Kind Code:

A1

Abstract:

Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area, and the width of the first terminal is different than the width of the second terminal outside the package body.

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Inventors:

KIM BYOUNG SUNG (KR)
LIM SANG EUN (KR)
LEE JAE JIN (KR)
SON YEOUN CHUL (KR)

Application Number:

PCT/KR2012/008726

Publication Date:

May 02, 2013

Filing Date:

October 23, 2012

Export Citation:

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Assignee:

SEOUL SEMICONDUCTOR CO LTD (KR)

International Classes:

H01L33/48; H01L33/62

Foreign References:

KR20100063877A	2010-06-14
EP2284914A1	2011-02-16
KR20100093950A	2010-08-26
US20110127569A1	2011-06-02

Other References: