LIGHT EMITTING ELEMENT PACKAGE AND LIGHT EMITTING DEVICE COMPRISING SAME

Title:

LIGHT EMITTING ELEMENT PACKAGE AND LIGHT EMITTING DEVICE COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2016/032134

Kind Code:

A1

Abstract:

A light emitting element package according to an embodiment comprises: a light emitting element comprising a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second lead frames spaced apart from each other; first and second solder units placed on first and second lead frames, respectively; and first and second pads placed between the first and second solder units and the first and second conductive semiconductor layers, respectively, wherein at least one of the first and second pads comprises at least one of a rounding part and a chamfer part.

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WO/2008/007535	MOUNTING METHOD, MOUNTING STRUCTURE, METHOD FOR MANUFACTURING ELECTRONIC EQUIPMENT, ELECTRONIC EQUIPMENT, METHOD FOR MANUFACTURING LIGHT EMITTING DIODE DISPLAY, AND LIGHT EMITTING DIODE DISPLAY

Inventors:

LEE SANG YOUL (KR)
CHOI JIN KYUNG (KR)
HONG JUN HEE (KR)

Application Number:

PCT/KR2015/007827

Publication Date:

March 03, 2016

Filing Date:

July 28, 2015

Export Citation:

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Assignee:

LG INNOTEK CO LTD (KR)

International Classes:

H01L33/62

Foreign References:

KR100812737B1	2008-03-12
KR20110084138A	2011-07-21
EP2393132A2	2011-12-07
KR20130072413A	2013-07-02
US20110147779A1	2011-06-23

Attorney, Agent or Firm:

PARK, Young Bok et al. (KR)
박영복 (KR)

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