Title:
LIGHT-SENSITIVE POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1980/001212
Kind Code:
A1
Abstract:
Light-sensitive polyamide resin composition, which contains polyamide containing in the molecular chain 10 - 70 wt% polyoxyethylene segment or poly(oxyethylene/oxypropylene) copolymer segment having a number-average molecular weight of 150 - 1,500 and a photo-polymerizable unsaturated compound. This composition provides a printing plate having an excellent softness, good developability with water alcohol or the like, and excellent transparency, toughness, and durability.
Inventors:
CHIBA K (JP)
MURAKI T (JP)
EGAWA K (JP)
MURAKI T (JP)
EGAWA K (JP)
Application Number:
PCT/JP1979/000307
Publication Date:
June 12, 1980
Filing Date:
November 30, 1979
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
CHIBA K (JP)
MURAKI T (JP)
EGAWA K (JP)
CHIBA K (JP)
MURAKI T (JP)
EGAWA K (JP)
International Classes:
G03F7/037; (IPC1-7): G03C1/68; G03C7/10; H01L21/302; C08L79/00; C08G73/00; G03F7/02
Foreign References:
| US3551148A | 1970-12-29 | |||
| JPS4428727B1 | ||||
| JPS465475B1 | 1971-02-10 |
Other References:
See also references of EP 0020782A4
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