Title:
LIGHT-TRANSMISSIVE RESIN MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/112782
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a light-transmissive resin member which can reduce mold release resistance when a mold is removed from a molded product (a light-transmissive resin member). Provided is a light-transmissive resin member (10A) having a surface on which a plurality of groove structures formed by a plurality of linear protruded parts and a plurality of linear depressed parts are formed, in which the linear protruded parts and the linear depressed parts extend in such a direction that these parts are parallel with each other, the grooves are formed at equal pitches in a first region (B1) included in the surface and are formed at unequal pitches in a second region (B2) other than the first region on the surface, each of the pitches of the grooves formed in the first region is a first pitch (a), the pitches of the grooves formed in the second region include at least a second pitch (b1) and a third pitch (b2), and the average pitch of the grooves formed in the second region is larger than the first pitch.
Inventors:
TOGAWA HIROYUKI (JP)
TAKAGI HIDEO (JP)
TAKAGI HIDEO (JP)
Application Number:
PCT/JP2022/044997
Publication Date:
June 22, 2023
Filing Date:
December 06, 2022
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD (JP)
International Classes:
B29C45/00; B29C45/26; B29C59/02; F21S41/275; F21S43/20; F21V5/00; G02B1/118; F21W102/00; F21W103/00
Domestic Patent References:
| WO2013002048A1 | 2013-01-03 |
Foreign References:
| JP2014133310A | 2014-07-24 | |||
| JP2021050138A | 2021-04-01 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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