LIGHT-TRANSMITTING IMPRINTING MOLD AND METHOD FOR MANUFACTURING LARGE-AREA MOLD

Title:

LIGHT-TRANSMITTING IMPRINTING MOLD AND METHOD FOR MANUFACTURING LARGE-AREA MOLD

Document Type and Number:

WIPO Patent Application WO/2014/115728

Kind Code:

A1

Abstract:

An imprinting method that has the following steps: an exposure step in which, with a light-transmitting imprinting mold placed up against a light-curing resin applied to a large-area substrate, said light-curing resin is exposed to curing light such that the amount of light that falls upon the light-curing resin in a shielded region cured by way of a shielding member (5) that is provided so as to reproduce a pattern of concavities and convexities in a transparent substrate is less than the amount of light that falls upon the light-curing resin in the remaining region, namely a transparent region, thereby semi-curing (9b) the light-curing resin in the shielded region; a separation step, after the exposure step, in which the mold is separated from the light-curing resin; a subsequent movement step in which the mold is moved such that the edge of the transparent region thereof is positioned above the semi-cured light-curing resin (9b); and a repetition step in which the exposure step and the separation step are repeated at the post-movement position.

Inventors:

MIYAZAWA YUKIHIRO (JP)

Application Number:

PCT/JP2014/051129

Publication Date:

July 31, 2014

Filing Date:

January 21, 2014

Export Citation:

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Assignee:

SOKEN KAGAKU KK (JP)

International Classes:

H01L21/027; B29C33/38; B29C59/02

Domestic Patent References:

WO2012164824A1	2012-12-06
WO2012018045A1	2012-02-09

Foreign References:

JP2013000944A	2013-01-07
JP4262271B2	2009-05-13
JP2010258326A	2010-11-11
JP2013038117A	2013-02-21
JP2013161997A	2013-08-19
JP4262271B2	2009-05-13

Other References: