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Patent Searching and Data


Title:
LINEAR FRICTION JOINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/200504
Kind Code:
A1
Abstract:
The present invention provides a linear friction joining device that is compact and inexpensive. In addition, provided is a linear friction joining device that is suitable for joining different materials and manufacturing a large-sized structure. The linear friction joining device according to the present invention for joining one member and another member, is characterized by: being provided with a holding mechanism that causes the one member to abut against the other member so as to form a joined interface, a vibration mechanism that causes the one member and the other member to be relatively excited, and a pressing mechanism that applies joining pressure to the joined interface substantially perpendicularly to the joined interface; and using an electric motor as a driving source of the vibration mechanism.

Inventors:
FUJII HIDETOSHI (JP)
MORISADA YOSHIAKI (JP)
AOKI YASUHIRO (JP)
KAMAI MASAYOSHI (JP)
Application Number:
PCT/JP2021/012371
Publication Date:
October 07, 2021
Filing Date:
March 24, 2021
Export Citation:
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Assignee:
UNIV OSAKA (JP)
International Classes:
B23K20/12
Foreign References:
US5849146A1998-12-15
JP2003126968A2003-05-08
US8181841B22012-05-22
US20190388997A12019-12-26
JP2017042772A2017-03-02
JP2018075591A2018-05-17
Attorney, Agent or Firm:
IPR CONSULTANT PPC (JP)
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