Title:
LIQUID COMPOSITION, PREPREG, RESIN-COATED METALLIC SUBSTRATE, WIRING BOARD, AND SILICA PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/210545
Kind Code:
A1
Abstract:
Provided are: a liquid composition comprising a heat-curable resin and silica particles, wherein the silica particles have (1) a specific amount of water vapor adsorption and a specific amount of change in water retention, (2) a specific charge amount and a specific d50, or (3) a specific powder friction angle, a specific d50, and a specific aggregation state; a prepreg, a resin-coated metallic substrate, and a wiring board which are obtained using the liquid composition; and the silica particles for use in the liquid composition.
Inventors:
KAMO HIROMICHI (JP)
Application Number:
PCT/JP2023/016013
Publication Date:
November 02, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
AGC INC (JP)
AGC SI TECH CO LTD (JP)
AGC SI TECH CO LTD (JP)
International Classes:
C08L101/00; B32B5/28; B32B15/08; B32B27/20; C01B33/12; C08J5/04; C08K3/36; C08L25/02; C08L63/00; C08L71/12; H05K1/03
Foreign References:
| JP2018100327A | 2018-06-28 | |||
| JP2008150578A | 2008-07-03 | |||
| JP2020097498A | 2020-06-25 | |||
| JP2015036357A | 2015-02-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: