Title:
LIQUID CURABLE SILICONE ADHESIVE COMPOSITION, CURED PRODUCT THEREOF, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/186165
Kind Code:
A1
Abstract:
[Problem] To provide: a liquid curable silicone adhesive composition, which is a one-pack type composition that can be stably stored at room temperature, and which can be primarily cured in the presence of moisture at around room temperature and undergoes secondary curing at a high temperature to form a layer strongly adherent to the substrate or member in contact therewith; a cured product (including a primarily cured product) thereof; a bonding method using these; and a use thereof. [Solution] A liquid curable silicone adhesive composition containing a curable organopolysiloxane having both a radical reactive group and a condensable group in the same molecule or in the whole mixture thereof, a condensation catalyst, an organic peroxide, an adhesion promoter, and a crosslinkable silane, said composition characterized in that a cured product obtained by primarily curing the composition in the presence of moisture at around room temperature has a storage modulus (G'1) and a cured product obtained by curing the composition at a high temperature has a storage modulus (G'2), the increase (Δ) in storage modulus therebetween being at least 50%; a primarily cured product thereof; and a use of these.
Inventors:
KODAMA HARUMI (JP)
FUJISAWA TOYOHIKO (JP)
USHIO YOSHITO (JP)
FUJISAWA TOYOHIKO (JP)
USHIO YOSHITO (JP)
Application Number:
PCT/JP2018/010860
Publication Date:
October 11, 2018
Filing Date:
March 19, 2018
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C09J183/07; C09J7/00; C09J11/04; C09J11/06; H01L21/301; H01L21/52
Foreign References:
| JPH10219197A | 1998-08-18 | |||
| JP2004075918A | 2004-03-11 | |||
| JP2007231195A | 2007-09-13 | |||
| JP2012219113A | 2012-11-12 | |||
| JP2011526648A | 2011-10-13 | |||
| JPH01132664A | 1989-05-25 | |||
| JPH10324860A | 1998-12-08 |
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