Title:
LIQUID METAL CONNECTION DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/115379
Kind Code:
A1
Abstract:
An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.
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Inventors:
NEKKANTY SRIKANT (US)
CHEN ZHE (CN)
MEYYAPPAN KARUMBU (US)
RAMIREZ MACIAS ANDRES (MX)
ERIKE ERIC (US)
KLEIN STEVEN A (US)
SMALLEY JEFFORY L (US)
ZHANG ZHICHAO (US)
CHEN ZHE (CN)
MEYYAPPAN KARUMBU (US)
RAMIREZ MACIAS ANDRES (MX)
ERIKE ERIC (US)
KLEIN STEVEN A (US)
SMALLEY JEFFORY L (US)
ZHANG ZHICHAO (US)
Application Number:
PCT/CN2021/140395
Publication Date:
June 29, 2023
Filing Date:
December 22, 2021
Export Citation:
Assignee:
INTEL CORP (US)
NEKKANTY SRIKANT (US)
CHEN ZHE (CN)
MEYYAPPAN KARUMBU (US)
RAMIREZ MACIAS ANDRES (MX)
ERIKE ERIC (US)
KLEIN STEVEN A (US)
SMALLEY JEFFORY L (US)
ZHANG ZHICHAO (US)
NEKKANTY SRIKANT (US)
CHEN ZHE (CN)
MEYYAPPAN KARUMBU (US)
RAMIREZ MACIAS ANDRES (MX)
ERIKE ERIC (US)
KLEIN STEVEN A (US)
SMALLEY JEFFORY L (US)
ZHANG ZHICHAO (US)
International Classes:
G01R1/02
Domestic Patent References:
| WO2020183832A1 | 2020-09-17 |
Foreign References:
| US20130000117A1 | 2013-01-03 | |||
| CN208350949U | 2019-01-08 | |||
| CN211557669U | 2020-09-22 | |||
| US6710369B1 | 2004-03-23 | |||
| US20180035551A1 | 2018-02-01 | |||
| US20090116194A1 | 2009-05-07 |
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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