Title:
LIQUID METAL MICROCAPSULE, CONDUCTIVE PASTE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/217920
Kind Code:
A1
Abstract:
The present application relates to the technical field of advanced materials, and provides a liquid metal microcapsule, a conductive paste and a preparation method therefor, and an electronic device. The liquid metal microcapsule provided in the present application comprises: a liquid metal core, a connecting layer coated on the outer side of the liquid metal core, and a coating layer coated on the outer side of the connecting layer; a bonding force between the connecting layer and a liquid metal is greater than a bonding force between the coating layer and the liquid metal, and a bonding force between the connecting layer and the coating layer is greater than the bonding force between the coating layer and the liquid metal. The technical solution of the present application can improve the stability of a conductive paste containing the liquid metal.
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Inventors:
REN ZHONGWEI (CN)
MEN ZHENLONG (CN)
MEN ZHENLONG (CN)
Application Number:
PCT/CN2021/132359
Publication Date:
October 20, 2022
Filing Date:
November 23, 2021
Export Citation:
Assignee:
BEIJING DREAM INK TECH CO LTD (CN)
International Classes:
H01B1/22; H01B13/00
Foreign References:
| CN111128440A | 2020-05-08 | |||
| CN107938369A | 2018-04-20 | |||
| JP2002008442A | 2002-01-11 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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