Title:
LOG MATERIAL
Document Type and Number:
WIPO Patent Application WO/2006/048945
Kind Code:
A1
Abstract:
A log material (1) composed of a pair of first plate materials (4) arranged with first cut end surfaces (3) facing sideways and a second plate material (6) whose cut end surface (5) is arranged to perpendicularly intersect the first cut end faces (3) of the first plate materials (4). An adhesive agent is applied to the surfaces at which the first plate materials (4) and the second plate material (6) are in contact, and they are firmly bonded by pressing to produce a laminate material for constructing the log wall of a laminated log house. Since the cut end faces (3, 5) of the adjacent plate materials (4, 6) face each other, shrinkage of the plate materials (4, 6) when they dry can be suppressed.
Inventors:
IMASE MICHIRU (JP)
Application Number:
PCT/JP2004/016538
Publication Date:
May 11, 2006
Filing Date:
November 08, 2004
Export Citation:
Assignee:
IMASE MICHIRU (JP)
International Classes:
B27M3/00; E04B2/02; (IPC1-7): E04B2/02; B27M3/00
Foreign References:
| JP2003232095A | 2003-08-19 | |||
| JPH0988208A | 1997-03-31 | |||
| JPS6095049A | 1985-05-28 |
Attorney, Agent or Firm:
Maeda, Kanji (4-179-1 Sue-cho Kakamigahara-shi Gifu, 08, JP)
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