Title:
LOOP HEAT PIPE-BASED HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/035574
Kind Code:
A1
Abstract:
Embodiments of the present application relate to the technical field of heat management, and discloses a loop heat pipe-based heat dissipation device. The heat dissipation device comprises a capillary pump (110), a vapor chamber (120), a heat dissipation member (130), N evaporation pipe sections (140) and N condensation pipe sections (150). The capillary pump (110) is disposed on the vapor chamber (120). The N evaporation pipe sections (140) are disposed on the vapor chamber (120). The N condensation pipe sections (150) are disposed on the heat dissipation member (130). The N evaporation pipe sections (140) and the N condensation pipe sections (150) alternately communicate end to end in sequence so as to form a flow pipe (160), and two ends of the flow pipe (160) communicate with an inlet (111) of the capillary pump (110) and an outlet (112) of the capillary pump (110), respectively, wherein N is greater than 1.
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Inventors:
LI BIYING (CN)
SUN ZHEN (CN)
XU QINGSONG (CN)
LI SHUAI (CN)
SUN ZHEN (CN)
XU QINGSONG (CN)
LI SHUAI (CN)
Application Number:
PCT/CN2022/081045
Publication Date:
March 16, 2023
Filing Date:
March 15, 2022
Export Citation:
Assignee:
ZTE INTELLIGENT TECH NANJING CO LTD (CN)
International Classes:
F28D15/02
Foreign References:
| CN101196382A | 2008-06-11 | |||
| CN102691999A | 2012-09-26 | |||
| CN202630760U | 2012-12-26 | |||
| CN102628655A | 2012-08-08 | |||
| CN101131306A | 2008-02-27 | |||
| US20110067843A1 | 2011-03-24 | |||
| US20080073066A1 | 2008-03-27 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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